OEM Good Quality Cable FPC (MIC0464)

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2017-11-18 11:14

  • Browse the number:

    319

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Company Profile

Dongguan LuPhi Electronics Technology Co., Ltd.

By certification [File Integrity]

Contact:Mr. Jason K. Young(Mr.)  

Email:

Telephone:

Phone:

Area:Guangdong

Address:Guangdong

Website: http://luphitech.ypdpgg.com/

Product details
Flexible circuit board (FPC) is made of a kind of laminated material that has insulation to resist heat, electrical properties, metal foil, and adhesive. Usually, conductive bumps allow conductivity between the flexible circuit board and another circuit board by pressing the bumps to pads with pressure. This creates electric flow between the systems. Flexible circuit boards are known for their lightness, thinness, flexibility, and convenience in size.


 
FPC has several advantages in many applications:
 
1) Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).
 
2) Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones (dynamic application). 

3) Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars,rockets and satellites. 

4) Electrical connections where board thickness or space constraints are driving factors. 
 
 Applications:

 
FPCs are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. In addition to cameras, a common application of flex circuits is in computer keyboard manufacturing; most keyboards made today use flex circuits for the switch matrix.

 
 
 Common Structures:

 
 
1) Single Side:
A single-conductor flex circuit is often employed as an inter-connect, either using connectors, or soldered directly to pads on the board using techniques such as hot bar soldering. 
 
 
 2) Double Sides:
 
Flex circuits with two conductive layers can be made with or without plated through-holes, though through-holes are usually provided. As with the single-layer circuit, apertures can be cut in the cover layer to allow assembly on one or both sides.
 
 
 3) Single Side Double Access
 
Applied with single sided material to make pattern but make some window on base film and add on cover layer on pattern top. The final products will have single layer copper but two side access possibility. This structure we call that single side double access boards. 
 
 
 4) Single Side plus Single Side
 
Binding two single sided FPC by end point joint. The bending area will be non adhesive for getting better flexibility. This structure so called single side plus single side with air gap.

 
 
 
 5) Multi-Layers
 
Binding several boards together so called Multi-layer and the drawing show here is an example of binding a single sided and a double sided FPC together.
 
 
 6) COF (Clip-on-film)
 
COF is a direct attaching chip technology that was an packaging structure for attaching a chip on a flexible board.
 
 
 7) Rigid-Flex Board
 
Binding flexible and rigid board structure together in same units as one part so called rigid-flex boards.


Item

Description

Technical capabilities

 
1

 
Layers

 
FPCB:8 layers
R-FPCB:20 layers

 
2

 
Max. Board Size

 
2000×800mm(79"×32")

 
3

 
Base Copper

 
Min. Thickness:1/3OZ(FPCB)
Max. Thickness:2OZ(FPCB)

 
4

 
Min. Finished Thickness

 
0.071mm/0.0028"(Single sided)
 
0.096mm/0.038"(Double sided)
0.305mm/0.012"(4 layers)

 
5

 
Max. Finished Thickness

 
3.8mm/0.150"

 
6

 
Min. Drill Diameter

 
0.15mm/0.006"

 
7

 
Aspect Ratio

 
10

 
8

 
Blind or Buried Via

 
yes

 
9

 
Min. Line Width/Spacing

 
0.05mm/0.002"

 
10

 
Insulation Resistance

 
≤50Ω

 
11

 
Conductive Resistance:

 
≥10MΩ

 
12

 
Testing Voltage

 
250 +/- 25V

 
13

 
Solderability Testing

 
245 +/- 5ºC Time 5 sec

 
14

 
Thermal Stress Testing

 
288 +/- 5ºC Time 10 sec

 
15

 
Flammability

 
94V-0

 
16

 
Surface Finishing

 
Flash Gold, Thick Gold (Hard or Soft Gold), Immersion Tin, Plating Tin, HASL, O.S.P, Silver Ink, Carbon Ink etc

 
17

 
Gold Type

 
Based On Gold Thickness :Flash Gold, Thick Gold
Based On Causes:ENIG, Plating Gold
Based On Component:Pure Gold(Soft Gold), Cobalt
Gold ( Hard Gold)

 
18

 
Stiffener Type

 
PI, PET, FR4, SUS etc.